Technical Developments
Dual Side QFN : Requested by Infineon, German / TI, USA, Applied to Smart Phone
SPM (Smart Power Mobile) : Under Development for Nex-Gen EV from HMC
Flip Chip Bonding and Clip Bonding
DSC Package : Under Development - Semiconductor for EV
Attaching of Top/Bottom Substrate
LTCC Package : Under Development (SiC + Al Soldering : 8x8x1.27mm)
TO-252 : Under Development (Cu Sintering, Al Soldering)
Al Pad Metal + Al Soldering + Cu Clip
48V MHSG Case Module (for H Company, EV Car)
6.5KV Case Module (for U Company, SiC Device)
DSC PKC Development using Ultrasonic Welding
Advanced PKG for 5G application (JMJ’s patent)
5G and 6G application (JMJ’s patent)
1700V, 250A case module using Full SiC with clip
