Technical Developments
SF DSC (Dual side cooling using 3D clip)
DSC using wire bonding and terminal welding
Bottom substrate
Top substrate
Top/Bottom joining
DSC package
DSC using welding technology of spacer
Dual Side QFN : Requested by Infineon, German / TI, USA, Applied to Smart Phone
SPM (Smart Power Mobile) : Under Development for Nex-Gen EV from HMC
Flip Chip Bonding and Clip Bonding
LTCC Package : Under Development (SiC + Al Soldering : 8x8x1.27mm)
TO-252 : Under Development (Cu Sintering, Al Soldering)
48V MHSG Case Module (for H Company, EV Car)
6.5KV Case Module (for U Company, SiC Device)
1700V, 300A Full SiC Package
1. Wire bonding
2. Block bonding
3. Clip bonding
4. Ultrasonic welding
